基恩士测量仪多少钱:帮忙翻译~

来源:百度文库 编辑:高考问答 时间:2024/04/30 00:11:59
One of the procedures used in making monolithic integrated circuits which overcomes this problem is photolithography based on photoresists. However, in recent years electron beam lithography based on electron resists has been used as an alternative method for cases in which resolution is desired. The lithographic process involves coating of the substrate, e.g.silicon dioxide,with resist and its exposure to light through a mask( image boundaries). Images can be produced by solvent development followed by etching and stripping of the resist. Resists must be capable of forming uniform pinhole-free films on a substrate by a simple process such as spinning, dip-coating or spraying, be of a high degree of purity, i.e. contain only low levels of ions to achieve no electrical properties, be easily removed by solvent dissolution, be thermally stable up to 150 centigrade to withstand the burn-in temperatures used for hybrid circuits, cause no stress on fine-wire bonds and no deleterious effects on active devices and be compatible with the devices and wire bonds of high density circuits.
Usually polymers are the only materials which fulfill these requirements. The interaction of organic polymers with energetic electrons or ultraviolet light results in structurally changed molecules which may either be broken down to smaller fragments or link together to form larger molecules. Interaction that causes a break in the main polymer chain and results in irradiated material having a lower average molecular weight than un-irradiated material allows positive-working resists to be formulated. Clearly the successful removal of irradiation-degraded polymer without affecting the un-irradiated material in the development process will occur if the original polymer has the highest possible molecular weight and is irradiated by moderate doses of electrons or ultraviolet light. Moreover, a polymer with a low glass transition temperature can easily be deformed and the resolution of fine patterns developed in a film of such a polymer may be impaired. Thus good positive resists should have a glass transition temperature above the highest temperature to which the resist will be subjected after development of the irradiated pattern in it.

用于做克服这问题的独块巨石的集成电路的过程之一是基于光致抗蚀剂的照相平版印刷。 然而,在基于电子的电子电波平版印刷术作为变通已被使用予以抵抗的最近几年用于在其中决定被期望的情况的方法。 平版画的过程包括涂上一层通过一种面具(形象边界)点燃底层,e.g.silicon二氧化物,抵抗以及其暴露。 形象能被有溶解力的发展生产其后是蚀刻和剥去抵抗。 抵抗必须有在一个底层上通过诸如旋转的一个简单的过程形成制服小孔自由的电影的能力, 沾涂上一层的或者喷洒, 具有高度的纯洁,即包含离子的仅仅低的水平没有取得电气的财产,被有溶解力的分解容易地移去,热稳定到百分度的150经受燃烧在用于混合电路的温度中,没有造成好电线合同的压力和对活跃的设备的不有害的影响并且与设备和高密度circuits.的电线合同相容聚合物通常是唯一的材料fulfill这些要求。 精力旺盛的电子的有机的聚合物或者任一个一起被出故障到较小的片段或者是联系以便形成较大的分子的在结构上改变的分子的紫外光结果的相互作用可能。 总体上,造成一段中断并且导致比非照射的材料一个较低的平均的分子的重量的照射的材料的相互作用聚合物连锁允许积极工作抵抗阐明。 成功的消除照耀降级的聚合物没有在发展过程中清楚地影响非照射的材料如果原来的聚合物有最高的可能的分子重量并且被电子或者紫外的光的适中的剂量照射,将发生。 此外,能容易地被变形带有一种低的玻璃转变过渡温度的一种聚合物,并且好的模式的决定在这样一种聚合物的一部电影中发展可能被损害。 这样好积极抵抗应该有在抵抗的最高的温度之上的一种玻璃转变过渡温度将在其中的照射的模式的发展之后被屈从。